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Ultra Low Power/High Speed CMOS SRAM 1M X 8 bit
Green package materials are compliant to RoHS
BH62UV8001
n FEATURES
Y Wide VCC low operation voltage : 1.65V ~ 3.6V Y Ultra low power consumption : VCC = 3.6V Operation current : 12mA (Max.)at 55ns 2mA (Max.) at 1MHz Standby current : 2.5uA (Typ.) at 3.0V/25OC VCC = 1.2V Data retention current : 1.2uA (Typ.) at 25OC Y High speed access time : -55 55ns (Max.) at VCC=1.65~3.6V Y Automatic power down when chip is deselected Y Easy expansion with CE1, CE2 and OE options Y Three state outputs and TTL compatible Y Fully static operation, no clock, no refresh Y Data retention supply voltage as low as 1.0V
n DESCRIPTION
The BH62UV8001 is a high performance, ultra low power CMOS Static Random Access Memory organized as 1,048,576 by 8 bits and operates in a wide range of 1.65V to 3.6V supply voltage. Advanced CMOS technology and circuit techniques provide both high speed and low power features with typical operating current of 1.5mA at 1MHz at 3.6V/25OC and maximum access time of 55ns at 1.65V/85OC. Easy memory expansion is provided by an active LOW chip enable (CE1), an active HIGH chip enable (CE2) and active LOW output enable (OE) and three-state output drivers. The BH62UV8001 has an automatic power down feature, reducing the power consumption significantly when chip is deselected. The BH62UV8001 is available in DICE form and 48-ball BGA package.
n POWER CONSUMPTION
POWER DISSIPATION PRODUCT FAMILY
BH62UV8001DI BH62UV8001AI
OPERATING TEMPERATURE
STANDBY
(ICCSB1, Max)
Operating
(ICC, Max)
PKG TYPE
VCC=1.8V 10MHz fMax.
VCC=3.6V
VCC=1.8V
1MHz
VCC=3.6V 10MHz
fMax.
1MHz
Industrial -40OC to +85OC
DICE 15uA 12uA 2mA 6mA 12mA 1.5mA 5mA 8mA BGA-48-0608
n PIN CONFIGURATIONS
1 A B C D E F G H NC NC DQ0 VSS VCC DQ3 NC A18 2 OE NC NC DQ1 DQ2 NC NC A8 3 A0 A3 A5 A17 NC A14 A12 A9 4 A1 A4 A6 A7 A16 A15 A13 A10 5 A2 CE1 NC DQ5 DQ6 NC WE A11 6 CE2 NC DQ4 VCC VSS DQ7 NC A19
n BLOCK DIAGRAM
A12 A11 A10 A9 A8 A7 A6 A5 A4 A3
Address Input Buffer
10 Row Decoder
1024
Memory Array
1024 x 8192
8192 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 8 Data Input Buffer 8 1024 Column Decoder 10 Control Address Input Buffer 8 Column I/O Write Driver Sense Amp
8
Data Output Buffer
CE1 CE2 WE OE VCC GND
A19 A18 A17 A15 A14 A13 A16 A2 A1 A0
48-ball BGA top view
Brilliance Semiconductor, Inc. reserves the right to change products and specifications without notice.
Detailed product characteristic test report is available upon request and being accepted.
R0201-BH62UV8001
1
Revision 1.1 May 2006
BH62UV8001
n PIN DESCRIPTIONS
Name
A0-A19 Address Input CE1 Chip Enable 1 Input CE2 Chip Enable 2 Input
Function
These 20 address inputs select one of the 1,048,576 x 8 bit in the RAM
CE1 is active LOW and CE2 is active HIGH. Both chip enables must be active when data read from or write to the device. If either chip enable is not active, the device is deselected and is in standby power mode. The DQ pins will be in the high impedance state when the device is deselected. The write enable input is active LOW and controls read and write operations. With the chip selected, when WE is HIGH and OE is LOW, output data will be present on the DQ pins; when WE is LOW, the data present on the DQ pins will be written into the selected memory location. The output enable input is active LOW. If the output enable is active while the chip is selected and the write enable is inactive, data will be present on the DQ pins and they will be enabled. The DQ pins will be in the high impendence state when OE is inactive. 8 bi-directional ports are used to read data from or write data into the RAM.
WE Write Enable Input
OE Output Enable Input
DQ0-DQ7 Data Input/Output Ports VCC VSS
Power Supply Ground
n TRUTH TABLE MODE
Chip De-selected (Power Down) Output Disabled Read Write
CE1
H X L L L
CE2
X L H H H
WE
X X H H L
OE
X
I/O OPERATION
High Z
VCC CURRENT
ICCSB, ICCSB1 ICC ICC ICC
X H L X High Z DOUT DIN
NOTES: H means VIH; L means VIL; X means don't care (Must be VIH or VIL state)
n ABSOLUTE MAXIMUM RATINGS
SYMBOL
VTERM TBIAS TSTG PT IOUT
(1)
n OPERATING RANGE
UNITS
V
O
PARAMETER
Terminal Voltage with Respect to GND Temperature Under Bias Storage Temperature Power Dissipation DC Output Current
RATING
-0.5
(2)
RANG
Industrial
AMBIENT TEMPERATURE
-40OC to + 85OC
VCC
1.65V ~ 3.6V
to 4.6V
-40 to +125 -60 to +150 1.0 20
C C
O
n CAPACITANCE
(1)
(TA = 25 C, f = 1.0MHz)
O
W
SYMBOL PAMAMETER CONDITIONS MAX. UNITS
mA CIN 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. -2.0V in case of AC pulse width less than 30 ns R0201-BH62UV8001 CIO Input Capacitance Input/Output Capacitance VIN = 0V VI/O = 0V 6 8 pF pF
1. This parameter is guaranteed and not 100% tested.
2
Revision 1.1 May 2006
BH62UV8001
n DC ELECTRICAL CHARACTERISTICS (TA = -40 C to +85 C)
PARAMETER NAME VCC VIL VIH IIL ILO VOL VOH ICC ICC1 ICCSB ICCSB1 PARAMETER
Power Supply Input Low Voltage Input High Voltage Input Leakage Current Output Leakage Current Output Low Voltage Output High Voltage Operating Power Supply Current Operating Power Supply Current Standby Current - TTL Standby Current - CMOS VIN = 0V to VCC, CE1 = VIH or CE2 = VIL VI/O = 0V to V CC, CE1 = VIH or CE2 = VIL or OE = VIH V CC = Max, IOL = 0.1mA V CC = Max, IOL = 2.0mA V CC = Min, IOH = -0.1mA V CC = Min, IOH = -1.0mA CE1 = VIL, CE2 = VIH, IDQ = 0mA, f = FMAX(4) CE1 = VIL and CE2 = VIH, IDQ = 0mA, f = 1MHz CE1 = VIH, or CE2 = VIL, IDQ = 0mA CE1VCC-0.2V or CE20.2V, VINV CC-0.2V or VIN0.2V
VCC=1.8V VCC=3.6V VCC=1.8V VCC=3.6V VCC=1.8V VCC=3.6V VCC=1.8V VCC=3.6V VCC=1.8V VCC=3.6V VCC=1.8V VCC=3.6V VCC=1.8V VCC=3.6V VCC=1.8V VCC=3.6V
O
O
TEST CONDITIONS
MIN.
1.65 -0.3(2) 1.4 2.2 ---VCC-0.2 2.4 -----
TYP.(1)
-------6 8 1.0 1.5 -2.0 2.5(5)
MAX.
3.6 0.4 0.6 VCC+0.3(3) 1 1 0.2 0.4 -8 12 1.5 2.0 0.5 1.0 12 15
UNITS
V V V uA uA V V mA mA mA uA
1. Typical characteristics are at TA=25OC and not 100% tested. 2. Undershoot: -1.0V in case of pulse width less than 20 ns. 3. Overshoot: VCC+1.0V in case of pulse width less than 20 ns. 4. FMAX=1/tRC. 5. VCC=3.0V
O O
n DATA RETENTION CHARACTERISTICS (TA = -40 C to +85 C)
SYMBOL VDR ICCDR
(3)
PARAMETER
VCC for Data Retention Data Retention Current Chip Deselect to Data Retention Time Operation Recovery Time
TEST CONDITIONS
CE1VCC-0.2V or CE20.2V, VINVCC-0.2V or VIN0.2V CE1VCC-0.2V or CE20.2V, VINVCC-0.2V or VIN0.2V
VCC=1.2V
MIN.
1.0 -0
TYP. (1)
-1.2 ---
MAX.
-7.0 ---
UNITS
V uA ns ns
tCDR tR
See Retention Waveform tRC (2)
1. Typical characteristics are at TA=25OC and not 100% tested. 2. tRC = Read Cycle Time.
n LOW VCC DATA RETENTION WAVEFORM (1) (CE1 Controlled)
Data Retention Mode VDR1.0V
VCC
VIH
VCC
VCC
tCDR
CE1VCC - 0.2V
tR
VIH
CE1
R0201-BH62UV8001
3
Revision 1.1 May 2006
BH62UV8001
n LOW VCC DATA RETENTION WAVEFORM (2) (CE2 Controlled)
Data Retention Mode VCC VDR1.0V
VCC
VCC
tCDR
tR
CE20.2V
CE2
VIL
VIL
n AC TEST CONDITIONS
(Test Load and Input/Output Reference)
n KEY TO SWITCHING WAVEFORMS
WAVEFORM INPUTS MUST BE STEADY MAY CHANGE FROM "H" TO "L" MAY CHANGE FROM "L" TO "H" DON'T CARE ANY CHANGE PERMITTED DOES NOT APPLY OUTPUTS MUST BE STEADY WILL BE CHANGE FROM "H" TO "L" WILL BE CHANGE FROM "L" TO "H" CHANGE : STATE UNKNOW CENTER LINE IS HIGH INPEDANCE "OFF" STATE
Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Level tCLZ1, tCLZ2, tOLZ, tCHZ1, tCHZ2, tOHZ, tWHZ, tOW Output Load Others
VCC / 0V 1V/ns 0.5Vcc CL = 5pF+1TTL CL = 30pF+1TTL ALL INPUT PULSES
1 TTL Output CL(1)
VCC GND
10%
90%
90% 10%
Rise Time: 1V/ns
Fall Time: 1V/ns
1. Including jig and scope capacitance.
n AC ELECTRICAL CHARACTERISTICS (TA = -40 C to +85 C) READ CYCLE
JEDEC PARAMETER NAME PARANETER NAME CYCLE TIME : 55ns DESCRIPTION Read Cycle Time Address Access Time Chip Select Access Time Chip Select Access Time Output Enable to Output Valid Chip Select to Output Low Z Chip Select to Output Low Z Output Enable to Output Low Z Chip Select to Output High Z Chip Select to Output High Z Output Enable to Output High Z Data Hold from Address Change (CE1) (CE2) (CE1) (CE2) (CE1) (CE2) MIN. 55 ----10 10 5 ---10 TYP. ------------MAX. -55 55 55 30 ---25 25 25 -UNITS ns ns ns ns ns ns ns ns ns ns ns ns
O
O
tAVAX tAVQX tE1LQV tE2LQV tGLQV tE1LQX tE2LQX tGLQX tE1HQZ tE2HQZ tGHQZ tAVQX
tRC tAA tACS1 tACS2 tOE tCLZ1 tCLZ2 tOLZ tCHZ1 tCHZ2 tOHZ tOH
R0201-BH62UV8001
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Revision 1.1 May 2006
BH62UV8001
n SWITCHING WAVEFORMS (READ CYCLE) READ CYCLE 1
(1,2,4)
tRC ADDRESS tOH DOUT
(1,3,4)
tAA
tOH
READ CYCLE 2 CE1
tACS1 CE2 tCLZ DOUT
(5)
tACS2 tCHZ1, tCHZ2
(5)
READ CYCLE 3
(1, 4)
tRC ADDRESS tAA OE tOE CE1 tCLZ1 CE2 tCLZ2 DOUT
(5)
tOH
tOLZ tACS1 tOHZ tCHZ1
(5) (1,5)
tACS2
(5)
tCHZ2
(2,5)
NOTES: 1. WE is high in read Cycle. 2. Device is continuously selected when CE1 = VIL and CE2= VIH. 3. Address valid prior to or coincident with CE1 transition low and/or CE2 transition high. 4. OE = VIL. 5. Transition is measured 500mV from steady state with CL = 5pF. The parameter is guaranteed but not 100% tested.
R0201-BH62UV8001
5
Revision 1.1 May 2006
BH62UV8001
n AC ELECTRICAL CHARACTERISTICS (TA = -40 C to +85 C) WRITE CYCLE
JEDEC PARAMETER NAME PARANETER NAME DESCRIPTION Write Cycle Time Address Set up Time Address Valid to End of Write Chip Select to End of Write Write Pulse Width Write Recovery Time Write Recovery Time Write to Output High Z Data to Write Time Overlap Data Hold from Write Time Output Disable to Output in High Z End of Write to Output Active (CE1, WE) (CE2) 55 0 45 45 35 0 0 -25 0 -5 CYCLE TIME : 55ns MIN. TYP. ------------MAX. -------20 --25 -ns ns ns ns ns ns ns ns ns ns ns ns UNITS
O O
tAVAX tAVWL tAVWH tELWH tWLWH tWHAX tE2LAX tWLQZ tDVWH tWHDX tGHQZ tWHQX
tWC tAS tAW tCW tWP tWR1 tWR2 tWHZ tDW tDH tOHZ tOW
n SWITCHING WAVEFORMS (WRITE CYCLE) WRITE CYCLE 1
(1)
tWC ADDRESS tWR1 OE tCW CE1
(5) (11) (3)
CE2
(5)
tAW WE tAS tOHZ DOUT
(4,10)
tCW
(11)
tWR2
(2)
(3)
tWP
tDH tDW DIN
R0201-BH62UV8001
6
Revision 1.1 May 2006
BH62UV8001
WRITE CYCLE 2
(1,6)
tWC ADDRESS tCW
(11)
CE1
(5)
CE2
(5)
tAW WE tAS tWHZ DOUT
(4,10)
tCW
(11) (2)
tWP
tWR2
(3)
tOW tDW tDH
(8,9)
(7)
(8)
DIN
NOTES: 1. WE must be high during address transitions. 2. The internal write time of the memory is defined by the overlap of CE1 and CE2 active and WE low. All signals must be active to initiate a write and any one signal can terminate a write by going inactive. The data input setup and hold timing should be referenced to the second transition edge of the signal that terminates the write. 3. tWR is measured from the earlier of CE1 or WE going high or CE2 going low at the end of write cycle. 4. During this period, DQ pins are in the output state so that the input signals of opposite phase to the outputs must not be applied. 5. If the CE1 low transition or the CE2 high transition occurs simultaneously with the WE low transitions or after the WE transition, output remain in a high impedance state. 6. OE is continuously low (OE = VIL). 7. DOUT is the same phase of write data of this write cycle. 8. DOUT is the read data of next address. 9. If CE1 is low and CE2 is high during this period, DQ pins are in the output state. Then the data input signals of opposite phase to the outputs must not be applied to them. 10. Transition is measured 500mV from steady state with CL = 5pF. The parameter is guaranteed but not 100% tested. 11. tCW is measured from the later of CE1 going low or CE2 going high to the end of write.
R0201-BH62UV8001
7
Revision 1.1 May 2006
BH62UV8001
n ORDERING INFORMATION
BH62UV8001
X
X
Z
YY
SPEED 55: 55ns
PKG MATERIAL -: Normal G: Green, RoHS Compliant
GRADE I: -40oC ~ +85oC PACKAGE D: DICE A: BGA-48-0608
Note: Brilliance Semiconductor Inc. (BSI) assumes no responsibility for the application or use of any product or circuit described herein. BSI does not authorize its products for use as critical components in any application in which the failure of the BSI product may be expected to result in significant injury or death, including life-support systems and critical medical instruments.
n PACKAGE DIMENSIONS
NOTES: 1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS. 2: PIN#1 DOT MARKING BY LASER OR PAD PRINT. 3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS.
1.2 Max.
BALL PITCH e = 0.75 D 8.0 E 6.0 N 48 D1 5.25 E1 3.75
D1
e
VIEW A
48 mini-BGA (6 x 8)
E1
R0201-BH62UV8001
8
Revision 1.1 May 2006
BH62UV8001
n Revision History Revision No. 1.0 1.1 History Initial Production Version Change I-grade operation temperature range - from -25OC to -40OC Draft Date May 10,2006 May. 25, 2006 Remark Initial
R0201-BH62UV8001
9
Revision 1.1 May 2006

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